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MingFeng Packaging USA organizes latest packaging innovation presentation for CES Tech East 2018 in Las Vegas

North America, USA, US - The West, Secondary Packaging, Secondary Boxes, Cases, Product Development Services, Design

MingFeng Packaging will attend CES that is the world's gathering place for all who thrive on the business of consumer technologies. It has served as the proving ground for innovators and breakthrough technologies for 50 years.

The event will start on 9th Jan till 12th Jan 2018, and MingFeng USA team will gather numerous packaging design and outstanding display to be ready for this global innovation event. 

  • Date: 9th - 12th Jan 2018
  • MingFeng booth: Hall A-D 40366
  • Location:Las Vegas Convention and World Trade Center
  • Topic Entry
  • English
  • Modified 28 Dec 2017
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