From 8th to 11th January 2019, MingFeng Packaging USA will be in Las Vegas attending CES 2019.

• Location: Tech West, Venetian, Sands Expo
• Booth #408070

CES is the world's gathering place for all those who thrive on the business of consumer technologies. It has served as the proving ground for innovators and breakthrough technologies for 50 years — the global stage where next-generation innovations are introduced to the marketplace.

During this 3 day event, MingFeng will share its latest development of packaging solution for consumer eletronics and various market offerings.