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Record number of visitors at Empack, Logistics & Distribution and Packaging Innovations 2019

  • Empack & Packaging Innovations Madrid
Europe, Iberia, Spain, Beauty, Personal Care, Eating, Drinking, Health, Home Care, Consumer Durables, Shows, Associations, Media, Packaging Trade Shows, Events, Easyfairs
  • More than 11,000 professionals in attendance
  • 52% of the exhibitors have already confirmed their participation in the next edition, which will be held on November 25 and 26, 2020.
  • Among the novelties planned for next year are the Robotic Village and the Tech hub. There will also be a guest country for the first time.

Empack, Logistics & Distribution and Packaging Innovations closed its doors on a high note, welcoming over 11,000 professionals through its doors for the 2019 Madrid event. Raquel Carboneras, director of the fairs commented:

“We have had more than 11,200 unique visitors and over 52% of the exhibitors have already confirmed their participation for next year, consolidating the event's position as the meeting point in Spain for packaging and logistics professionals. All subsectors of this complex world have been represented in our classrooms, so we are really the only ones that offer a 360-degree vision and solutions for the entire value chain nationwide.”

This diversity has also been reflected in over 40 hours of conferences which addressed all the key issues for the sector: sustainability, circular economy, new European regulations, automation, new technologies and materials, consumer trends, e-challenges commerce, etc. These meetings, which brought together national and international experts and representatives of large companies, have been highly successful, hailing as one of the best-valued events of the visitors to the halls.

The next edition of Empack, Logistics & Distribution and Packaging Innovations will take place on November 25 and 26, 2020 at IFEMA.

New for 2020: more robotics, automation, plus a guest country

Some of the novelties that the fairs will incorporate next year can now be revealed. Among them, is the Robotic Village, a specific area that will bring together companies that are dedicated to robotics and automation, a key sector that will experience exponential growth in the coming years and that will transform the current landscape.

Another new area will be the Tech Hub, a section where start-ups and technology companies will show all the innovations in IT applicable to the packaging and logistics sectors.

For the first time, there will also be a guest country to continue advancing with the internationalization of the halls, as in this 2019 edition some 20% of exhibiting companies were international or multinational.

See also

Catalonia, Madrid and Valencia communities significant presence at Empack 2019

Catalonia, Madrid and Valencia communities' significant presence at Empack 2019

Empack, the reference fair in southern Europe for the sectors of packaging and labeling, raw materials, industrial packaging and packaging accessories continues to grow. 150 exhibitors have already confirmed their participation at the next edition, which will be held on November 13 and 14 at IFEMA. Catalonia and Madrid will be the autonomous communities with the most representation, alongside companies from Germany, Italy, Turkey, Portugal and the UK.

La sostenibilidad protagonista de Empack, Label&Print, Packaging Innovations y Logistics & Distribution 2019

Sustainability at the heart of Empack, Label & Print, Packaging Innovations and Logistics & Distribution 2019

Edible containers, biodegradable containers made with mango or intelligent packaging that warn of the expiration of a product changing color, are some of the novelties of a sector that is undergoing a huge transformation and is increasingly committed to the care of the environment. This is indicated by Raquel Carboneras, director of Empack, Label & Print, Packaging Innovations and Logistics & Distribution, the reference fairs in southern Europe for everything related to packaging and logistics.

  • Company News
  • English
  • Modified 20 Nov 2019
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