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Understand more about “Industrie 4.0” when looking at the newly developed ultrasonic generator by Herrmann Ultraschall. The generator is the heart beat of the ultrasonic welding process answerable for repeatability and precision. Complex control algorithms and interfaces ensure an intelligent and sensible interaction with the production environment for perfect weld results.
We are The Recognized Technology Leader and a manufacturer of ultrasonic welding machines, generators and sonotrodes.
The PLASTICS division offers solutions for the joining of injection molded thermoplastic parts. Ultrasonic welding is clean, safe and environmentally friendly. It is impossible to imagine industry without this joining technology in various market segments. We offer patented solutions for welding applications with the highest strength, precision and repeatability.
The NONWOVENS division offers applications for continuous production in the fields of bonding, laminating, embossing, perforating, sewing and cutting of nonwoven, foils, paper and filter materials. In close cooperation with our customers we have become the market leader by developing innovative ultrasonic components.
The PACKAGING division offers fast and airtight ultrasonic packaging sealing solutions with a focus on high throughput and sustainability. Different materials and new packaging designs require continuous development of new economic solutions for the packaging industry. We develop and deliver the complete solution for the packaging machine and incorporate ultrasonic sealing -- fast -- safe -- airtight. In addition, we offer solutions for food cutting by the use of ultrasonic knives.
Our dedicated sales engineers with their extensive training and knowledge are available to meet with you. Our consultation will be supported by our experts in the modern and technologically advanced local application laboratories. We will find a solution for your joining challenge. Don't hesitate to contact us!
An ultrasonically bonded polyethylene back sheet was developed by The Dow Chemical Company and Herrmann Ultrasonics, with advanced ultrasonic technology, to address the key market need for hygiene absorbent products that bring more comfort by decreasing noise and enhancing softness. For many years, the hygiene industry has tried to introduce ultrasonic bonding technology for back sheet lamination to meet cost reduction and sustainability industry drivers. Until now, final haptic properties of the diaper, critical to the consumer, such as noise and softness, had to be sacrificed.
Herrmann Ultrasonics’ VE MICROBOND CSI technology in combination with Dow’s improved PE film formulation offers innovative “Adhesive Free In-line Lamination” that delivers softness and low noise. Increased web speeds (exceeding 2,000 feet per minute), immediate bond strength, quality assurance, and high-speed lamination of multiple layers have also been achieved.
